| PART |
Description |
Maker |
| CBR04C110F5GAC |
Ceramic, High Q, Microwave (CBR), 11 pF, 1%, 50 V, 0402, C0G, SMD, Fixed, RF, Ultra High Q, Low ESR, Class I
|
Kemet Corporation
|
| CBR04C160F5GAC |
Ceramic, High Q, Microwave (CBR), 16 pF, 1%, 50 V, 0402, C0G, SMD, Fixed, RF, Ultra High Q, Low ESR, Class I
|
Kemet Corporation
|
| CBR04C101F3GAC |
Ceramic, High Q, Microwave (CBR), 100 pF, 1%, 25 V, 0402, C0G, SMD, Fixed, RF, Ultra High Q, Low ESR, Class I
|
Kemet Corporation
|
| AQ137M3R3CA7ME AQ12EM110FAJWE |
CAP 3.3PF 500V .25PF PORC- 9030PPM SMD-1111 TR-7 MICROWAVE CAPACITOR, CERAMIC, MULTILAYER, 500 V, 0.0000033 uF, SURFACE MOUNT
CAP 11PF 150V 1% PORC- 9030PPM SMD-0505 WAFFLE-PAK MICROWAVE CAPACITOR, CERAMIC, MULTILAYER, 150 V, 0.000011 uF, SURFACE MOUNT
|
AVX, Corp.
|
| ECDG0E100C ECDG0ER108 ECDG0E1R1B ECDG0E2R0B ECDG0E |
Multilayer Ceramic Capacitors(High-Q Capacitors)
High-Q Capacitors (Microwave Chip Capacitors)
|
Panasonic Semiconductor
|
| CDR11BP100AGYS CDR11BP101AGYS CDR11BP102AGYS CDR11 |
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.00001 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.0001 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.001 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.00075 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.000075 uF, SURFACE MOUNT CHIP
CAP 2200PF 50V 5% X7R SMD-1111 WAFFLE-PAK BASE/BARR/SOLDER MICROWAVE R-MIL-PRF-55681 CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.0022 uF, SURFACE MOUNT
|
AVX, Corp.
|
| MGF1952A |
Microwave Power MES FET (Leadless Ceramic Package)
|
Mitsubishi Electric Semiconductor
|
| PS205KVP8.2PF/-2PFR16 PS405KVP1000PF/-10N2200 PS20 |
CAPACITOR, CERAMIC, 0.0000082 uF, CHASSIS MOUNT
CAPACITOR, CERAMIC, 0.001 uF, CHASSIS MOUNT
CAPACITOR, CERAMIC, 0.000033 uF, CHASSIS MOUNT
CAPACITOR, CERAMIC, 0.00033 uF, CHASSIS MOUNT
CAPACITOR, CERAMIC, 0.00039 uF, CHASSIS MOUNT
CAPACITOR, CERAMIC, 0.00047 uF, CHASSIS MOUNT
CAPACITOR, CERAMIC, 0.000047 uF, CHASSIS MOUNT
CAPACITOR, CERAMIC, 0.00002 uF, CHASSIS MOUNT
CAPACITOR, CERAMIC, 0.000022 uF, CHASSIS MOUNT
CAPACITOR, CERAMIC, 0.000027 uF, CHASSIS MOUNT
CAPACITOR, CERAMIC, 0.000056 uF, CHASSIS MOUNT
CAPACITOR, CERAMIC, 0.00056 uF, CHASSIS MOUNT
CAPACITOR, CERAMIC, 0.0000056 uF, CHASSIS MOUNT
CAPACITOR, CERAMIC, 0.0000068 uF, CHASSIS MOUNT
CAPACITOR, CERAMIC, 0.00012 uF, CHASSIS MOUNT
|
Vishay Intertechnology, Inc.
|
| AMF-5B-040080-15-25P AMF-4B-040080-15-25P AMF-6B-0 |
4000 MHz - 8000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER
12000 MHz - 18000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER
20000 MHz - 30000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER
100 MHz - 4000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER
8000 MHz - 18000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER
500 MHz - 2000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER
27500 MHz - 31000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER
10 MHz - 2000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER
2000 MHz - 4000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER
2000 MHz - 8000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER
10 MHz - 4000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER
1000 MHz - 2000 MHz RF/MICROWAVE WIDE BAND HIGH POWER AMPLIFIER
100 MHz - 6000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER
37000 MHz - 41000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER
|
MITEQ, Inc.
MITEQ INC
|
| RFP-250-200RM-S |
0 MHz - 2000 MHz RF/MICROWAVE FIXED ATTENUATOR ROHS COMPLIANT, CERAMIC, FM-2
|
Anaren, Inc.
|
| BMC0805HF-R27K BMC BMC0402HF-10NK BMC0402HF-12NK B |
1 ELEMENT, 0.18 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
1 ELEMENT, 0.056 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
1 ELEMENT, 0.001 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
1 ELEMENT, 0.0033 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
1 ELEMENT, 0.0022 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Surface Mount Multilayer High Frequency Ceramic Chip Inductors 0402 - 0805 Industry Sizes
1 ELEMENT, 0.1 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
1 ELEMENT, 0.015 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
|
BITECH[Bi technologies]
BI Technologies Corporation
|
| HPQ-09W HPQ-06 HPQ-10 HPQ-10W HPQ-04 HPQ-07 HPQ-08 |
POWER SPLITTERS/COMBINERS 690 MHz - 830 MHz RF/MICROWAVE COMBINER, 0.4 dB INSERTION LOSS
POWER SPLITTERS/COMBINERS 510 MHz - 570 MHz RF/MICROWAVE COMBINER, 0.4 dB INSERTION LOSS
POWER SPLITTERS/COMBINERS 900 MHz - 970 MHz RF/MICROWAVE COMBINER, 0.45 dB INSERTION LOSS
POWER SPLITTERS/COMBINERS 880 MHz - 1030 MHz RF/MICROWAVE COMBINER, 0.5 dB INSERTION LOSS
POWER SPLITTERS/COMBINERS 730 MHz - 800 MHz RF/MICROWAVE COMBINER, 0.4 dB INSERTION LOSS
POWER SPLITTERS/COMBINERS 315 MHz - 395 MHz RF/MICROWAVE COMBINER, 0.45 dB INSERTION LOSS
POWER SPLITTERS/COMBINERS 580 MHz - 690 MHz RF/MICROWAVE COMBINER, 0.4 dB INSERTION LOSS
POWER SPLITTERS/COMBINERS 680 MHz - 790 MHz RF/MICROWAVE COMBINER, 0.4 dB INSERTION LOSS
POWER SPLITTERS/COMBINERS 480 MHz - 600 MHz RF/MICROWAVE COMBINER, 0.4 dB INSERTION LOSS
POWER SPLITTERS/COMBINERS 380 MHz - 490 MHz RF/MICROWAVE COMBINER, 0.4 dB INSERTION LOSS
POWER SPLITTERS/COMBINERS 410 MHz - 455 MHz RF/MICROWAVE COMBINER, 0.35 dB INSERTION LOSS
POWER SPLITTERS/COMBINERS 1700 MHz - 2400 MHz RF/MICROWAVE SPLITTER AND COMBINER, 0.71 dB INSERTION LOSS
POWER SPLITTERS/COMBINERS 990 MHz - 1100 MHz RF/MICROWAVE COMBINER, 0.45 dB INSERTION LOSS
|
Mini-Circuits
|
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